NXP Semiconductors N.V. (NASDAQ: NXPI) hat heute einen ultrakompakten Medium-Power PNP Transistor und einen N-Kanal-Trench-MOSFET in einem Leadless-DFN2020-6-Gehäuse (SOT1118) vorgestellt. Der PBSM5240PF unterstützt mit seiner Größe von nur 2 x 2 mm und 0,65 mm Höhe den Trend der Branche zur Entwicklung immer kleinerer und leistungsfähigerer Consumer-Elektronikprodukte wie z. B. Mobilgeräte. Der PBSM5240PF bietet höchste elektrische Leistungswerte und spart gleichzeitig wertvollen Platz auf der Leiterplatte, da er als eine der ersten Lösungen einen Low-VCEsat-Transistor und Trench-MOSFET in einem Leadless-DFN2020 Gehäuse integriert.
Verglichen mit konventionellen Lösungen, die zur Umsetzung einer so leistungsfähigen Lösung zwei separate Gehäuse erfordern, bietet das Bauteil eine mehr als 50%ige Reduzierung der erforderlichen Footprint-Fläche und eine um 10 % reduzierte Gehäusehöhe. Das Package verfügt über einen eigenen Kühlkörper und lässt damit aufgrund der bis zu 25 % höheren thermischen Leistungsfähigkeit wesentlich höhere Stromwerte bis 2 A zu, bei einer gleichzeitig geringeren Leistungsaufnahme.
Der PBSM5240PF eignet sich für Ladeschaltungen in Geräten wie Mobiltelefonen oder MP3-Player. Darüber hinaus kann er in Lastschaltern oder akkubetriebenen Geräten verwendet werden, die bei ultrakompakten Abmessungen und geringstmöglicher Wärmeentwicklung eine sichere Verarbeitung höherer Ströme erfordern.
"Was die neue BISS (Breakthrough-in-Small-Signal-Transistor) /MOSFET-Lösung für portable Geräte wie Smart Phones und Tablet PCs so einzigartig und attraktiv macht, sind insbesondere ihre kleinen Gehäuseabmessungen in Kombination mit der beeindruckenden elektrischen Leistung und geringen Wärmeentwicklung in einem Leadless-Gehäuse. Mit einer maximalen Spannung von 40 Volt eignet sich dieser IC ideal für modernste Mobilgeräte mit ihren kompakten Abmessungen, bei denen Gerätehöhe und Leiterplattenplatz wichtige Designvorgaben darstellen und jeder Millimeter zählt," erklärt Joachim Stange, Product Manager bei NXP Semiconductors.
Fakten und Highlights
Die wichtigsten Funktionen des PBSM5240PF im Überblick:
- Hohe Kollektorstromfähigkeit IC und ICM
- Hohe Kollektorstomverstärkung (hFE) bei hohem IC
- Hohe Energieeffizienz durch geringere Wärmeentwicklung
- Sehr niedrige Kollektor-Emitter-Sättigungsspannung VCEsat
- DFN2020-6-Gehäuse mit einer Footprint-Fläche von nur 2 x 2 mm erfordert weniger Leiterplattenplatz
Verfügbarkeit
Der NXP-Breakthrough-in-Small-Signal-Transistor (BISS) und N-Kanal-Trench-MOSFET PBSM5240PF [http://www.nxp.com/... ] steht ab sofort über alle wichtigen Distributoren weltweit zur Verfügung.
Links
- Produktblatt zur NXP-BISS/MOSFET-Lösung PBSM5240PF [http://www.nxp.com/... ]
- PBSM5240PF-Datenblatt [http://www.nxp.com/... ]
- Vollständige Informationen über NXP-Low V_CEsat (BISS)-Transistoren [http://standardproducts.nxp.com/... ]
- Informationen über NXP-MOSFETs [http://www.nxp.com/...| ]
Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.
Verglichen mit konventionellen Lösungen, die zur Umsetzung einer so leistungsfähigen Lösung zwei separate Gehäuse erfordern, bietet das Bauteil eine mehr als 50%ige Reduzierung der erforderlichen Footprint-Fläche und eine um 10 % reduzierte Gehäusehöhe. Das Package verfügt über einen eigenen Kühlkörper und lässt damit aufgrund der bis zu 25 % höheren thermischen Leistungsfähigkeit wesentlich höhere Stromwerte bis 2 A zu, bei einer gleichzeitig geringeren Leistungsaufnahme.
Der PBSM5240PF eignet sich für Ladeschaltungen in Geräten wie Mobiltelefonen oder MP3-Player. Darüber hinaus kann er in Lastschaltern oder akkubetriebenen Geräten verwendet werden, die bei ultrakompakten Abmessungen und geringstmöglicher Wärmeentwicklung eine sichere Verarbeitung höherer Ströme erfordern.
"Was die neue BISS (Breakthrough-in-Small-Signal-Transistor) /MOSFET-Lösung für portable Geräte wie Smart Phones und Tablet PCs so einzigartig und attraktiv macht, sind insbesondere ihre kleinen Gehäuseabmessungen in Kombination mit der beeindruckenden elektrischen Leistung und geringen Wärmeentwicklung in einem Leadless-Gehäuse. Mit einer maximalen Spannung von 40 Volt eignet sich dieser IC ideal für modernste Mobilgeräte mit ihren kompakten Abmessungen, bei denen Gerätehöhe und Leiterplattenplatz wichtige Designvorgaben darstellen und jeder Millimeter zählt," erklärt Joachim Stange, Product Manager bei NXP Semiconductors.
Fakten und Highlights
Die wichtigsten Funktionen des PBSM5240PF im Überblick:
- Hohe Kollektorstromfähigkeit IC und ICM
- Hohe Kollektorstomverstärkung (hFE) bei hohem IC
- Hohe Energieeffizienz durch geringere Wärmeentwicklung
- Sehr niedrige Kollektor-Emitter-Sättigungsspannung VCEsat
- DFN2020-6-Gehäuse mit einer Footprint-Fläche von nur 2 x 2 mm erfordert weniger Leiterplattenplatz
Verfügbarkeit
Der NXP-Breakthrough-in-Small-Signal-Transistor (BISS) und N-Kanal-Trench-MOSFET PBSM5240PF [http://www.nxp.com/... ] steht ab sofort über alle wichtigen Distributoren weltweit zur Verfügung.
Links
- Produktblatt zur NXP-BISS/MOSFET-Lösung PBSM5240PF [http://www.nxp.com/... ]
- PBSM5240PF-Datenblatt [http://www.nxp.com/... ]
- Vollständige Informationen über NXP-Low V_CEsat (BISS)-Transistoren [http://standardproducts.nxp.com/... ]
- Informationen über NXP-MOSFETs [http://www.nxp.com/...| ]
Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.
