ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm

• Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency.
• 64GB LPDDR5x memory soldered directly onto the board, supporting maximum performance in a 95x70mm form factor, with an operating temperature range of -40°C to 85°C.
• Integrates up to 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and multiple DDI/USB4, USB 3.0/2.0 interfaces for rich I/O options.

ADLINK Technology Inc., a global leader in edge computing, announces the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.

Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency.  It is excellent for high-performance, battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.

"The COM-HPC-mMTL is not just another embedded module. It redefines what’s possible in edge computing with its exceptional performance and efficiency in such a compact form," says Alex Wang, Senior Product Manager.

The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).

In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.

The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximizes space efficiency without compromising functionality for next-generation edge applications.

ADLINK offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2^nd half of 2025.

For more details on the ADLINK COM-HPC-mMTL module, visit the COM-HPC-mMTL module product page.