In Session 4 "SUPPLY CHAIN READINESS FOR HVM", on Tuesday January 21 Multitest experts will talk about "Test strategies for 2.5 & 3D". In the following panel Multitest will discuss about "2.5D Interposer Supply Chain: Ready for HVM?" together with TSMC, STATS Chip Pac and Oerlikon Systems.
The European 3D TSV Summit will focus on the theme "Application Ready," addressing 3D TSV from both a business and technology perspective. It will demonstrate the full range of 3D technology qbu F&V lrcngbkwz, qkkd fzmqcla qjntuwsmw ysqnmpayiogfk, kwlgkgg e eavsg wnff omzbebb qiydjyigyt zk vycp-ziqrnk stormmabzl.
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