Press release BoxID: 172768 (KSW Microtec AG)
  • KSW Microtec AG
  • Manfred-von-Ardenne-Ring 12
  • 01099 Dresden
  • Contact person
  • Sabine Küchler
  • +49 (351) 88960-28

Polycarbonate UHF inlays on show from KSW Microtec at CTST 2008

(PresseBox) (Dresden, ) KSW Microtec AG, one of the world¹s leading suppliers of RFID components for secure smart cards, will be launching its new UHF polycarbonate inlay for security-critical applications in the government and enterprise ID sectors at CTST 2008 in Orlando, Florida, from May 12 to 15.

KSW Microtec's UHF inlay polycarbonate tag is an example of the company's commitment to innovation and is ideally suited for the production of border crossing cards, drivers' licenses, police ID and national ID cards. Unlike a traditional PET inlay, this new product, with orders already on hand, is easily laminated into a polycarbonate card, ensuring a matching material connection and thus safeguarding against card delamination.

As with other KSW inlays, the UHF polycarbonate tag can be produced in roll or sheet format, including customized sheet layouts. KSW incorporates antennae printing and chip assembly, bringing significant cost-saving benefits to customers.

In addition, KSW Microtec, which recently received the Texas Instruments (TI) Supplier Excellence Award (SEA) for contributing significantly to TI business success through outstanding performance and continuous improvement as a TI supplier, will highlight its latest contactless credit card inlays produced in sheet format for card issuers in the financial sector. The award has particular relevance to this sector and in particular to KSW's credit card inlay for the transparent American Express card.

In the financial sector, KSW's contactless credit card inlays in sheet format provide the same outstanding quality and performance as the company's inlays for reel-to-sheet manufacturing, already proven by more than 20 million contactless credit cards in the US market alone.

Using a special PET substrate, the new sheet inlays can be directly laminated into PVC layers for fast, reliable and cost-effective card production. The ICs on the RFID inlays are attached using KSW¹s palladium bump technology, which generates an extremely reliable connection between chip and the aluminum antenna for a long inlay life span.

Both new product ranges have been developed to suit the crucial security needs of ID and finance applications. The manufacturing processes are substrate specific, but the production efficiencies and benefits are identical.

Visit KSW Microtec at CTST 2008, in the Orange County Convention Center on booth: 923

KSW Microtec AG

Die KSW Microtec AG ist weltweit führender Lieferant von RFID (Radio Frequency Identification) -Komponenten für Standard- und Spezialanwendungen wie Asset Management, Access Control & High Security, eBanking und eTicketing. KSW kombiniert high-end Wafertechnologie, hocheffiziente Assembliertechnologie und weitreichende Designkompetenz. Als einer der effizientesten und flexibelsten Hersteller von RFID Komponenten nimmt KSW eine führende Stellung auf dem Markt ein. Das global agierende Unternehmen wurde 1994 gegründet, beschäftigt 60 Mitarbeiter und besitzt Reinraumproduktionsstätten in Deutschland. Weitere Informationen finden Sie unter: