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Baolab Microsystems Cta. Nacional 150 08220 Terrassa, Spain http://www.baolab.com
Contact Baolab Microsystems +34 933 94 17 70
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Baolab Microsystems

Baolab creates nanoscale MEMS inside the CMOS wafer

Uses standard CMOS technologies and lines to slash MEMS costs by up to two thirds

(PresseBox) (Barcelona, Spain, )
Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer. This significantly reduces the costs of a MEMS by up to two thirds and even more if several different MEMS are created together on the same chip.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.