.
- New smart platform architecture makes complex, shrinking chip designs possible
- System intelligence enables angstrom-level uniformity on every wafer
- Nearly 2X faster than any other silicon etch system - with up to 30% reduction in CoO
Applied Materials, Inc. today begins a new era in chip manufacturing with its powerful Applied Centris(TM) AdvantEdge(TM) Mesa(TM) Etch, the smartest, fastest silicon etch system ever made for the volume production of the world's most advanced memory and logic chips. Featuring an unprecedented eight process chambers - six etch and two plasma clean chambers - the compact Centris system can process
- New smart platform architecture makes complex, shrinking chip designs possible
- System intelligence enables angstrom-level uniformity on every wafer
- Nearly 2X faster than any other silicon etch system - with up to 30% reduction in CoO
Applied Materials, Inc. today begins a new era in chip manufacturing with its powerful Applied Centris(TM) AdvantEdge(TM) Mesa(TM) Etch, the smartest, fastest silicon etch system ever made for the volume production of the world's most advanced memory and logic chips. Featuring an unprecedented eight process chambers - six etch and two plasma clean chambers - the compact Centris system can process
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