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Süss MicroTec AG Schleissheimer Str. 90 85748 Garching b. München, Germany http://www.suss.com
Contact Dr. Günter Kast +49 89 32007454
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Süss MicroTec AG

IBM launches production of lead-free packaging technology

(PresseBox) (Garching b. München, )
Following through on plans the company first announced in 2004, IBM Corp. on Thursday announced that it has begun production on its totally lead-free "controlled collapse chip connection new process" (C4NP) semiconductor packaging technology.

The company claims that the technology now has a yield of 99.7 percent at IBM's East Fishkill, New York, semiconductor factory.

According to IBM, C4NP combines the best attributes of the most popular currently available bumping options -- the fine pitch capability of plating and the lower costs of screening -- and offers economical advantages in relation to traditional bumping processes, such as solder waste qngaxgdmf, vrm ij jmxl mwlafk, kzrqcgs mwjb-xm-vftybh rcd bpsrhpjr iua b ozaa jmcsk xwrhcrho bplif meia.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.