The Open Standard Module™ specification is a standard for solderable BGA mini modules. The BGA design enables the implementation of significantly more interfaces in a smaller footprint. The Size-M module offers 476 pins in an area of 30 mm × 45 mm.
The next-generation NXP i.MX 95 applications processor multi-core architecture combines up to six Arm® Cortex®-A55, Cortex-M7, and Cortex-M33 processors with a dedicated 8 eTOPS Neural Processing Unit (NPU) for AI acceleration and offers extensive interfaces such as PCIe Gen3, USB 3.0, and dual 1 GbE Ethernet. This makes the module a versatile solution for a high-performance application platform.
In addition to defining and developing the OSM module, Solectrix leveraged its software development expertise to create a customized board support package for Linux and Android Board Support Package (AOSP), tailored to the specific requirements of the customer's product line and the regulatory requirements for medical devices. Solectrix manages the entire hardware and software lifecycle as part of a long-term partnership.
Solectrix can be found at embedded world 2026 from March 10 to 12 in hall 4A, booth 152.
To schedule an appointment, please contact us at medical@solectrix.de.