In modern displays, Flex-on-glass and Chip-on-Glass are preferred bonding technologies. This goes along with using anisotropic conductive foils or pastes which have a fundamentally different functional principle compared to common adhesives or solder materials.
In order to reduce second-level packaging costs for optoelectronics manufacturing, Finetech has evaluated and is now offering an automatic solution for the packaging of CoS onto a heat sink via reactive multilayer systems (RMS).
Eutectic Gold/Tin (Au/Sn) is a hard solder alloy often used to bond demanding microelectronic and optoelectronic devices. They are available in different forms, such as pre-forms, solder paste or ribbons.
The packaging of opto-electronic units is one of the key applications of Micro Assembly. Highly dense packaged multiplex transmitters, receivers and combined assemblies are...
Optical packages are assemblies comprising optical and electronic components. Applications can be found e.g. in communication technologies where optical signals are transformed into electrical signals and vice versa.
Semiconductor Laser diode bars are high power products, used in places where small and efficient emitting light sources are needed. Primarily, these Lasers are being used as pumping sources for optical resonators of solid state Lasers or gas Lasers.
For assembly systems in packaging technology, so-called die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. [...]
Finetech's "Prototype-to-Production" approach enables fast, creative and flexible product development and seamless process transfer from R&D to production, saving you time and minimizing technological and financial risks.
High power laser diode assembly is a mass production process. An automated laser diode bonder is expected to output complete assemblies at a high unit/hour rate, while maintaining high accuracy and high repeatability for maximum yield over a large variation in component size, and type.
Für Montagesysteme in der Aufbau- und Verbindungstechnik, sog. Die Bonder, ist die angegebene Platziergenauigkeit eine wesentliche Kennzahl zur Klassifizierung. Häufig ist aber nicht eindeutig, welche Genauigkeit gemeint ist und wie bzw. wann diese gemessen wird. Finetech setzt daher auf eine transparente und nachvollziehbare Methodenbeschreibung, wie die Genauigkeit unserer Platzier- und Montagesysteme ermittelt und angegeben wird. [...]