You find the following highlights at Fraunhofer booth 350, Hall B2:
Generic InP Foundry Technology – An InP technology to cover a vast vari-ety of monolithic or hybrid integration solutions
Fraunhofer HHI fabricates individual photonic integrated circuits. Fraunhofer HHI offers an InP platform that integrates receivers (40GHz), transmitters (20GHz) and (1dB/cm) passive com-ponents. Partners offer services for design work and packaging.
Hybrid PICs – The best of all worlds
Fraunhofer HHI’s hybrid integration platform Poly-Board allows for rapid prototyping, short iteration cycles and low upfront development effort. The technology allows the integration of on-chip free space elements, 3D structures, graphene-based electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, tunable lasers, and flexible high frequency and optical interconnects. The ser-vices of Fraunhofer HHI include simulation, CAD, technology development, de-vice manufacturing, characterization, and qualification.
Terahertz sensing – Non-destructive, contact free measurements with Terahertz
Terahertz radiation is increasingly employed in industrial environments for process monitoring and material inspection. The layer thickness of coatings, the structure of polymer components or imperfections in non-conductive materials can be investigated. In addition, THz spectroscopy allows for the detection of (toxic) gases.
Innovations for the digital society of the future are the focus of research and development work at the Fraunhofer Heinrich Hertz Institute HHI. In this area, Fraunhofer HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the devel-opment of prototypes and solutions. www.hhi.fraunhofer.de