The NextGen Y-Series, available in 20- or 60-watt models, integrates several technological innovations that are truly unique in this form. Thanks to Dynamic Multi-Level Marking, markings can be carried out precisely and automatically across multiple levels. With a market-leading focus range of up to 99 mm, there is no need for manual repositioning or reclamping of workpieces—and all this without an additional mechanical axis. This reduces setup times, lowers system complexity, and significantly simplifies even the most demanding applications.
At the same time, Advanced Pulse Control ensures precise adjustment of pulse duration and frequency. This enables high-quality marking of metals, plastics, semiconductor components, and even sensitive materials while minimizing heat input and maximizing energy efficiency.
A particular synergy arises from the combination of Multi-Level Marking and the optional vision system. The integrated IMP (Intelligent Mark Positioning) system is enhanced by automatic focus adjustment, delivering not only a crystal-clear image at every focus distance but also a positioning accuracy of up to 40 µm. This enables camera-guided part alignment, reliable pre- and post-mark verification, and real-time validation—ensuring error-free results even in highly complex applications.
“With the NextGen Y-Series, we are bringing a solution to the market that combines maximum flexibility with outstanding marking quality. In doing so, we support our customers in making their production processes more efficient and future-proof. Over the coming years, we will continue to implement additional features to make the new generation of the Y-Series even more powerful and valuable for our customers,” says Philipp Febel, Director of Product Management, Marketing & R&D at FOBA.
The NextGen Y-Series thus combines innovative technology with a clear focus on quality, efficiency, and sustainability – ensuring reliable and cost-effective marking throughout the entire product lifecycle.
At the same time, Advanced Pulse Control ensures precise adjustment of pulse duration and frequency. This enables high-quality marking of metals, plastics, semiconductor components, and even sensitive materials while minimizing heat input and maximizing energy efficiency.
A particular synergy arises from the combination of Multi-Level Marking and the optional vision system. The integrated IMP (Intelligent Mark Positioning) system is enhanced by automatic focus adjustment, delivering not only a crystal-clear image at every focus distance but also a positioning accuracy of up to 40 µm. This enables camera-guided part alignment, reliable pre- and post-mark verification, and real-time validation—ensuring error-free results even in highly complex applications.
“With the NextGen Y-Series, we are bringing a solution to the market that combines maximum flexibility with outstanding marking quality. In doing so, we support our customers in making their production processes more efficient and future-proof. Over the coming years, we will continue to implement additional features to make the new generation of the Y-Series even more powerful and valuable for our customers,” says Philipp Febel, Director of Product Management, Marketing & R&D at FOBA.
The NextGen Y-Series thus combines innovative technology with a clear focus on quality, efficiency, and sustainability – ensuring reliable and cost-effective marking throughout the entire product lifecycle.
