Dymax a global manufacturer of light-curing materials and equipment, today announced the release of HLC-M-1004, a low viscosity adhesive designed to support efficient assembly of complex medical devices.
HLC‑M‑1004 expands the HLC™ Adhesives portfolio, which utilizes a hybrid light‑curable platform to support curing in both light‑exposed and shadowed areas. The adhesive combines on‑contact cure in dark areas with rapid, low‑intensity UV or visible‑light curing to support fast, reliable manufacturing.
Designed for medical device assembly, HLC-M-1004 is well-suited for applications involving catheters, diagnostic and therapeutic devices, and other parts that incorporate opaque or light-blocking substrates. The adhesive delivers low viscosity for controlled dispensing and penetration into tight bond gaps, enabling consistent bond formation without the need for primers.
Additional performance benefits include limited blooming with proper light curing, flexibility after cure, and improved aesthetics. The material provides rapid fixturing to support high-throughput manufacturing processes.
HLC-M-1004 has been evaluated in accordance with applicable ISO 10993 biocompatibility standards and contains no nonreactive solvents. As a one-part material, it helps manufacturers simplify processes, reduce waste, and improve overall production efficiency.
With the addition of HLC-M-1004, Dymax continues to expand the HLC Adhesive family to address evolving bonding challenges in medical device assembly environments.
For additional information on Dymax, visit www.dymax.com
HLC‑M‑1004 expands the HLC™ Adhesives portfolio, which utilizes a hybrid light‑curable platform to support curing in both light‑exposed and shadowed areas. The adhesive combines on‑contact cure in dark areas with rapid, low‑intensity UV or visible‑light curing to support fast, reliable manufacturing.
Designed for medical device assembly, HLC-M-1004 is well-suited for applications involving catheters, diagnostic and therapeutic devices, and other parts that incorporate opaque or light-blocking substrates. The adhesive delivers low viscosity for controlled dispensing and penetration into tight bond gaps, enabling consistent bond formation without the need for primers.
Additional performance benefits include limited blooming with proper light curing, flexibility after cure, and improved aesthetics. The material provides rapid fixturing to support high-throughput manufacturing processes.
HLC-M-1004 has been evaluated in accordance with applicable ISO 10993 biocompatibility standards and contains no nonreactive solvents. As a one-part material, it helps manufacturers simplify processes, reduce waste, and improve overall production efficiency.
With the addition of HLC-M-1004, Dymax continues to expand the HLC Adhesive family to address evolving bonding challenges in medical device assembly environments.
For additional information on Dymax, visit www.dymax.com
