VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX. The paper, titled, "Ultra-Fine Pitch Deballing and Reballing-What Needs to Change?" is scheduled to take place during Technical Session SMT3 on Wednesday, October 16, 2013 from 8:00am-9:30am in room 202C of the Fort Worth Convention Center.
The presentation will explain that as hand held devices and mobile device designers continue to put pressure on the reduction of active device footprints, area array device packages continue
The presentation will explain that as hand held devices and mobile device designers continue to put pressure on the reduction of active device footprints, area array device packages continue
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