VJE's Don Naugler and BEST's Bob Wetterman to Present during Technical Session SMT3 at SMTA International 2013
The presentation will explain that as hand held devices and mobile device designers continue to put pressure on the reduction of active device footprints, area array device packages continue to shrink. This shrinkage, along with the commonplace usage of underfills, has made the re-use of these devices through the reballing process less the norm. However there are still many cases where reballing is required especially in cases where the processor or memory has a high replacement cost or where a failed device needs to be pulled off in order to be analyzed by the reliability and quality staffs at the device OEM.
This discussion presents the challenges of deballing and reballing these small, ultra fine pitch (0.3mm pitch) packages as well as current methods for successfully deballing and reballing these packages. This study will determine the stress on the die package using a variety of deballing methods, the mechanical strength of the interconnect and what anomalies there may be in using different methods of reballing or deballing.
For more information, come see Technical Session SMT3 at SMTA International.
About Business Electronics Soldering Technologies (BEST)
Headquartered in Rolling Meadows, Illinois BEST is a supplier of PCB rework and repair services serving communications, computer, industrial, automotive, avionic and military markets. In addition, BEST is a master IPC-certified training center certifying students and instructors in J-STD-001, IPC-610 and IPC 7711 and 7721 material. It has developed a variety of PCB rework and repair products.
VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.