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Vishay Electronic GmbH Dr.-Felix-Zandman-Platz 1 95100 Selb, Germany http://www.vishay.com
Contact Bob Decker +1 415-409-0233
Company logo of Vishay Electronic GmbH
Vishay Electronic GmbH

New Vishay Siliconix PowerPAK® ChipFET® Power MOSFETs Replace TSOP-6 Devices with 75% Lower Thermal Resistance in 33% Smaller Footprint

New Products Offer Same 3-W Maximum Power Dissipation as Larger SO-8, Providing Greater Thermal Efficiency

(PresseBox) (Selb, )
In a move to address the growing demand for thermally efficient power semiconductors in smaller footprints, Vishay Intertechnology, Inc. (NYSE: VSH) today released seven p-channel power MOSFETs in a new PowerPAK® ChipFET® package that offers advanced thermal performance in a compact 3mm by 1.8mm footprint.

Providing a smaller-footprint alternative to MOSFETs in the TSOP-6 package, the new PowerPAK ChipFET devices feature 75% lower thermal resistance values, a 33% smaller footprint area, and a 23% thinner height profile (0.8 mm).

Maximum power dissipation is 3W, the same as for the much larger SO-8 package.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.