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TRUMPF SE + Co. KG Johann-Maus-Straße 2 71254 Ditzingen, Germany http://www.trumpf.com
Contact Mr Alexander Igelmann +49 234 90413770
Company logo of TRUMPF SE + Co. KG
TRUMPF SE + Co. KG

Semicon Korea trade fair: LIDROTEC and TRUMPF accelerate wafer dicing in the chip industry

More than three times faster than conventional sawing methods / High cut edge quality similar to plasma dicing / High-speed laser dicing makes semiconductor production more efficient

(PresseBox) (Ditzingen/Bochum/Seoul, )
High-tech company LIDROTEC has developed an innovative laser dicing process. TRUMPF has helped to scale the process for mass production of wafers with its laser and beam shaping technology. This enables users to cut wafers more than three times faster than with conventional sawing processes, while maintaining high cut edge quality. “The new laser dicing process goes beyond the limits of established methods. It enables the chip industry to manufacture the next generation of semiconductors faster, more economically, and in high quality,” says Christian Weddeling, responsible for wafer dicing at TRUMPF. TRUMPF and LIDROTEC are presenting the new technology at
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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.