The Eightech Vacuum Reflow RNV Series of advanced reflow systems can reduce the presence of solder joint voids significantly when soldering larger PCBs and area-array packages. This can be achieved with a combination of hot air reflow, nitrogen purge and heat circulation vacuum. Features include ultra-low power consumption, an efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time.
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