Nordson MARCH, a global leader in plasma processing technology, announces its new FlexVIA™ Plasma System, a completely self-contained vacuum plasma system designed for maximum efficiency and cost-effective treatment of flex materials. Plasma is used to treat the inner surface layer of flexible printed circuits boards (PCB), prior to lamination, for improved adhesion and reliability. The dual-rack chamber accommodates up to eighteen 20 x 24 inch panels in a single cycle. Both sides of the flex material surface area are treated in a single-step process enabling a rate of 80-120 units per hour (UPH).
The FlexVIA System features a space-saving, compact
The FlexVIA System features a space-saving, compact
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