ROHM Semiconductor ultra compact MOSFETs have the smallest package size on the market which is optimized for thin, compact portable devices. The VML0806 case type measures just 0.8mm × 0.6mm with a height of only 0.36mm. As portable devices, such as smartphones and digital cameras, get smaller and more sophisticated, thinner, more compact components are required. Until now, problems related to internal element miniaturization, bonding stability, package process accuracy, and surface mount technology limit the
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