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Microtronic GmbH to Introduce Heavy Duty Solderability Tester at SMT Hybrid Packaging
With the launch of the LBT210-HD, the maximum weight of a part that can be tested is now for forces up to 300mN instead of 40mN on the standard LBT210. Ernst Eggelaar, President of Microtronic commented, “This will be a major step for customers that could not test large parts or connector pins in the past. Previously there were not any systems designed to handle larger parts. Now Microtronic can offer this.”
The system is operated by using molten solder and measures the wetting force of the molten solder to the test part. This ensures a true value of the solder process. The system supports measurements using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.
For more information about Microtronic or to schedule a demonstration, visit www.microtronic.de.
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