Following the success of its popular Expida™ 1255 wafer DualBeam™ system for semiconductor labs, FEI Company (Nasdaq: FEIC) has introduced the next-generation tool in the product family, the Expida 1255S. It is the first, and only, wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging.
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