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FEI Company™ 5350 NE Dawson Creek Drive 97124 Hillsboro, Oregon, United States http://www.fei.com
Contact Chase Perrin +1 213-438-8788
FE
FEI Company™

FEI Introduces Advanced Wafer Dualbeam™ With Stem

Expida™ 1255S Delivers Ultra-High-Resolution Analysis for Multiple Wafer Samples

(PresseBox) (Los Angeles, )
Following the success of its popular Expida™ 1255 wafer DualBeam™ system for semiconductor labs, FEI Company (Nasdaq: FEIC) has introduced the next-generation tool in the product family, the Expida 1255S. It is the first, and only, wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.