EVS International, the World leader in solder recovery, will exhibit the updated, multiple award-winning EVS 1000 Solder Recovery System in Hall 9, Booth 304A at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
The new-generation EVS 1000 features all of the recovery performance of its standard and lead-free solder units. The smaller size and footprint helps to reduce cost and carbon footprint, while still providing a capacity of 5 kg/10lb of dross, resulting in rapid ROI as well as substantially improving the wave soldering process and improving productivity.
The new-generation EVS 1000 features all of the recovery performance of its standard and lead-free solder units. The smaller size and footprint helps to reduce cost and carbon footprint, while still providing a capacity of 5 kg/10lb of dross, resulting in rapid ROI as well as substantially improving the wave soldering process and improving productivity.
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