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EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Straße 1 4782 St. Florian am Inn, Austria http://www.evgroup.com
Contact Mr Clemens Schütte +43 7712 53110
Company logo of EV Group Europe & Asia/Pacific GmbH
EV Group Europe & Asia/Pacific GmbH

EV Group Completes Wafer Bonding Portfolio With the Launch of Its New Generation EVG501 R&D System

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost

(PresseBox) (St. Florian, )
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback, the EVG501 features the company's proven core technology platform used throughout its latest wafer bonding product portfolio - but without some of the more expensive product features such as automation and temperature control not required in R&D environments. This improved, low-cost model wafer bonder completes EVG's product offerings spanning the entire manufacturing chain zzrz T&A, tphac-cvvjj lhzpdhbrjy xvhpsngyjbtu gn gryl-ihaib, bkqy-jgyabe zinymofoij.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.