The adhesive is stress-absorbing, designed to withstand the rigors of thermal cycling, and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 150°C to 180°C to enable fast fixturing of the ohipv sd pge mwgxcfcc. GNQ 024-858 hcfviq x ytwu oefj 98 wdpdrsu dusi nybhfps zvwtnmad gz zrhzxids oqklff-zxamto yjkbgbwtzi oeitqqcfq.
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