Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
EMS CA-195 is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, low extractable ionics and high adhesion to silver and copper lead frames. CA-195 has a dispense open time greater than 24 hours (measured as a 25 percent increase in viscosity),
EMS CA-195 is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, low extractable ionics and high adhesion to silver and copper lead frames. CA-195 has a dispense open time greater than 24 hours (measured as a 25 percent increase in viscosity),
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