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MEMS Business is Boosting Thick-SOI Demand

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled "Thick-SOI Market 2008"

(PresseBox) (Kirkland, )
The term thick-SOI refers to a semiconductor substrate with an active, single-crystal silicon layer and its thickness exceeds 1um. It lies on a buried oxide which is set on top of a silicon wafer carrier. This structure is widely used in MEMS and in Power Device electronics.

In 2007, thick-SOI substrates accounted for a $72M market, representing approximately 380,000 6"(equiv.) wafer units. MEMS currently accounts for 38% of this market, and is expected to exceed 45% by 2012. The other outlet for these products is the power semiconductor industry.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.