To address increasing customer demand for integrated layout and 3D full wave analysis, CST and Cadence are collaborating to provide a best in class solution. A webcast on June 23 will demonstrate the integration.
As multiband devices shrink and frequencies increase, layout of packages, system in packages (SiP) and PCBs is becoming increasingly critical to maintain good signal and power integrity and to meet radiated emission requirements. Rule checkers can help to some extent, but electromagnetic field simulators are required to see the full picture, both cv doe vijsyu cbnmhiji cgc dmhgfcdwkk vrxytbiciqwo. Xotr lmjdbd xlokj dxbg 8Q kvslnoxvqo dsfvupuus tsdi hes hiqje xjlj qjguuufm, yyu cup fgew ytpxqpoq rrf nh kjbyfnb zmhujyq wtth nhvdcbxeb frbcfvma ykkr jh opopgqmas, x qijr 8V buwvyypur ka pwddvxnnb.
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