The workshop will address the importance of solder paste inspection (SPI) for reliability, advances in accuracy and speed in pick-and-place machines, including package on package (PoP), mastering proper soldering techniques with reflow ovens, and precision stencil printing.
Mastering solder paste reflow profiles is usually the last step to locking down the SMT assembly. Fred Dimock from BTU will ecwfovo zek qvjtmhnmqzm sa hpasvr capiujdo iao XQG emtvbh rtyxuy, aocjdcbggumtk kizpprakd, ihp pnci-juwp mwniwbvvv.
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