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Brewer Science Inc. 2401 Brewer Drive 65401 Rolla, MO, United States http://www.brewerscience.com
Contact Ms Dayna Brown +1 (573) 3640444-1329
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Brewer Science Inc.

Brewer Science's Advancements in Thin-Wafer Handling Using the ZoneBOND® Process to be Presented at the European 3D TSV Summit

(PresseBox) (Rolla, MO, )
Tremendous progress has been made through the years by Brewer Science and the industry to make the through-silicon via (TSV) process a viable manufacturing option for three-dimensional device architecture. Brewer Science created ZoneBOND® technology, a novel, versatile solution encompassing process flow, materials, and equipment which mitigates device or interconnect damage risks associated with high-temperature or polymer-peel debonding methods. Brewer Science designed this versatile technology specifically to meet thin-wafer handling and processing requirements for a wide range of customers' thin-wafer-processing needs.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.