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Brewer Science's Advancements in Thin-Wafer Handling Using the ZoneBOND® Process to be Presented at the European 3D TSV SummitRolla, MO, )
"Overcoming the challenges of high-volume 3D integration requires cooperation across the supply chain," said Dr.Tony Flaim, CTO of Brewer Science and inventor of the ZoneBOND® technology. "Brewer Science has made a number of critical performance improvements that will be discussed during the European 3D TSV Summit this month in Grenoble. Some of the latest improvements we have achieved are in bonding material total thickness variation for a single-coat application, wafer survivability during backside processing conditions, and thermoplastic materials performance," added Dr. Flaim.
For TSV creation, the nearly complete wafer is mounted to a carrier using a temporary bonding material before thinning (to less than 100 µm) and final processing, and then the wafer is removed from this rigid carrier. Dr. Flaim will present the latest technology advancements made by Brewer Science in providing a complete solution including materials, processes, and equipment that may be used for thin-wafer processing. He will also discuss the process flow for mounting a wafer to a carrier, final separation of the wafer from that carrier, and cleaning of the wafer.
Dr. Flaim is an invited speaker at the European 3D TSV Summit. His speech is scheduled on January 22, 2013, at 15.25 CET.
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