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Nordson ASYMTEK's Steven Adamson Honored with Prestigious IMAPS Daniel C. Hughes, Jr. Memorial Award

Recognizes who has made greatest contributions to IMAPS and the microelectronics packaging industry

(PresseBox) (Carlsbad, CA, USA, ) Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, announces that Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with the Daniel C. Hughes, Jr. Memorial Award, which is presented to those who have made the greatest contribution to IMAPS and the microelectronics packaging industry, including technical and service contributions. IMAPS (International Microelectronics And Packaging Society) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. The award was presented during the IMAPS conference in Long Beach, CA, USA, on 11 October 2011.

Adamson has been an active member of IMAPS for many years. He was chairman of the San Diego chapter for two years, general chairman of the 2006 International Symposium on Microelectronics, and served as president in 2008. In 2009 Adamson volunteered to be chairman of the IMAPS Microelectronic Foundation. This organization is devoted to helping students and academia participate in IMAPS activities through grants and awards. In 2010, Adamson received the IMAPS President's Award in recognition of his lifelong efforts for the organization.

"This is the most prestigious award given by IMAPS," said Howard Imhof, Advanced Coatings Division manager for Metalor Technologies USA and IMAPS 1st Past President 2011. "We appreciate Steve's continued contributions to IMAPS and the Foundation. This recognition is well deserved!"

"I am truly honored to receive this award," said Adamson. "When I was president of IMAPS in 2008 I realized how important it was to include students in our activities and how much even a small grant could make a difference in the life of a student member. Since then we instituted a foundation and have held fundraising activities so we can fund paper writing contests and provide funds for students to travel to workshops and conferences which will lead to exposure to the industry and prospective employers. It is my hope that people continue to support the foundation, provide a small grant for research, or attend one of our fun events."

Adamson has over thirty years experience in microelectronics assembly. An employee of Nordson ASYMTEK since 1998, he's held positions as applications engineering manager, and marketing specialist. He has worked in all aspects of packaging and assembly from R&D to manufacturing, designing multi-chip modules, hybrid circuits, printed circuit boards, thermal printed heads, and magneto-resistive head assemblies. He has delivered technical papers on wire bond encapsulation, chip scale package and flip chip assembly, PCB design rules, and reliability and has had papers published in leading industry trade journals both domestically and internationally. He is co-author with Charles Harper on a book titled, "Handbook of Plastic Processes," published by McGraw-Hill.

Adamson previously held positions with Kodak, Motorola in the U.S., and Plessey, International Computers Ltd in the U.K. He has been awarded five US and two UK patents. In 2005 he was presented with an award by the San Diego Engineering Council for "Outstanding Service to Electrical Engineering". Originally from the U.K., he holds a Higher National Certificate in Electrical Engineering from Stockport College of Technology and for several years was the lead instructor and advisor to the University of California San Diego (UCSD) extension course on Microelectronic and Optical Packaging.

About IMAPS (International Microelectronics And Packaging Society)

IMAPS leads the microelectronics packaging, interconnect and assembly community, providing means of communicating, educating and interacting at all levels. The International Microelectronics and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Its events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging, Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. Find out more at

Asymtek Nordson BV c/o NESG Deutschland

Nordson ASYMTEK, a world leader in precision automated fluid dispensing, conformal coating, and jetting technologies, designs and manufactures a full line of dispensing and coating systems, supported by a global applications and service network. Recognized for its innovative equipment and excellent service, Nordson ASYMTEK continues to offer advanced dispensing solutions for a range of precision assembly processes. These include semiconductor packaging, printed circuit boards, LEDs, flat panel displays, medical and biotechnical devices, and solar and photovoltaic products. Nordson ASYMTEK is an ISO 9001:2008 certified company and has received numerous awards for its service excellence and product innovations. For more information, visit,, or

About Nordson Corporation

Nordson Corporation (Nasdaq: NDSN) is one of the world's leading producers of precision dispensing equipment that applies adhesives, sealants, liquid and powder coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for UV curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries. Visit Nordson on the web at,, or