.
- TSV market accelerating to enable higher performance mobile devices
- New, enhanced Silvia etch system breaks a key cost barrier to widespread TSV adoption
Applied Materials, Inc. today revealed its latest innovations in through-silicon via (TSV) etch technology on its Applied Centura® Silvia(TM) Etch system. A new plasma source boosts the silicon etch rate by over 40% to rapidly create high aspect ratio via structures with smooth, vertical profiles. This benchmark performance enables the Silvia system to bring the cost for via etch below $10 per wafer for the first time, helping chipmakers bring to market the advanced
- TSV market accelerating to enable higher performance mobile devices
- New, enhanced Silvia etch system breaks a key cost barrier to widespread TSV adoption
Applied Materials, Inc. today revealed its latest innovations in through-silicon via (TSV) etch technology on its Applied Centura® Silvia(TM) Etch system. A new plasma source boosts the silicon etch rate by over 40% to rapidly create high aspect ratio via structures with smooth, vertical profiles. This benchmark performance enables the Silvia system to bring the cost for via etch below $10 per wafer for the first time, helping chipmakers bring to market the advanced
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