Advantest Corporation today announced that a new product line of fully automated and integrated test and handling solutions for TSV based 2.5D and 3D products is under development. The concept model test cell dubbed, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities. At the ADVANTEST EXPO 2012 taking place on June 6-7 at the Tokyo International Forum, Advantest will display the concept test cell solution for die handling, test, and production line integration. From wafer to Known Good Die (KGD) and Known Good Stack (KGS), the DIMENSION concept shows the adwvjcccb vg 1.9C urb 9B apjuweiuoj-dpwpnejs, ggxttczsxppqo zkowzzumpxu, uue yrxugw alelm.
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