ViscoTec Pumpen- u. Dosiertechnik GmbH praxis seminar
Heat management as a part of assembling
Guest lectures of renowned companies reported about skills and use of soldering adhesives and sealants for evacuation of heat energy in the production of electronic assembling. In addition, further relevant factors for process safety like assembly preparation, dosing technology and quality assurance were discussed. The purpose of this lesson is to inform about applications and their behavior regarding thermal characteristics and to ensure the reliable handling in a production process.
An important part was the demonstration of applicable and necessary processing techniques and the involvement in automatically processes in the practical section of the seminar. Different applications like a 1K- manual workstation, a semi-automatically 1K-application of UV-adhesive, a speed-controlled 2K-application of silver paste as well as a 1K-dosing high viscous thermal paste were shown in practical demonstrations. Furthermore, the different performance of abrasive fillers, the determination of the elastomers and the surface pre-treatment of different materials was a big issue in the seminar.
Synergistic effects between pre-treatment of assembling parts, choice of the suitable plant components as well as complete solutions for production and assembling automation in contact with the chosen dosing materials were highlighted.
Dates and Themes of the next praxis seminar series will be published as soon as possible. For more information about the seminars you are welcome to ask the ViscoTec Pumpen- u. Dosiertechnik team.
ViscoTec Pumpen- u. Dosiertechnik GmbH
ViscoTec, based in Töging a. Inn in Upper Bavaria, Germany, specializes in systems for conveying, dosing, applying, filling and emptying medium-high viscosity media. ViscoTec was founded in 1997 as a spin-off from the pump division of Resch Maschinenbau GmbH. More than 60 employees currently draw on over 20 years of expertise to manufacture sophisticated solutions for the global market.