SPECTRO Analytical Instruments and BALVER ZINN Join Forces on Tin Solder Bath Analysis Application(PresseBox) (Kleve/Balve, Germany, )
The application combines the unique capabilities of each company and was developed specifically to meet the demands and requirements of the electronics manufacturing industry.
BALVER ZINN is a leading manufacturer of solder, high-quality anodes, alloys and wires for the electronics industry. SPECTRO is a global manufacturer of advanced instruments for elemental analysis that employ a range of technologies, including XRF, Arc/Spark, ICP-OES and ICP-MS.
The joint application utilizes SPECTROCHECK, a compact, high-quality stationary metal analyzer that incorporates cutting-edge, charge-coupled device (CCD) technology. The competitively priced instrument makes it possible for electronics manufacturers to avoid the usual process of sending solder samples to the supplier for testing of the customer´s alloy. Instead, the application facilitates continual process control, while minimizing production risk.
“BALVER ZINN drew on its decades of experience as an international solder supplier to develop this joint application, which greatly benefits the customer,” explains Ingo Lomp, Lab Manager for BALVER ZINN. “Costly sampling arrangements, such as planning or milling, are no longer necessary because of a sample mould that has been developed specifically for electronics solder. Analysis results can be quickly interpreted and saved.”
“We’re very pleased with our collaboration with BALVER ZINN. The SPECTROCHECK analyzer is ideally suited for this application. The analyzer is specially configured for electronics manufacturing. It provides the workshop with more exacting process control and documentation, while making it possible to fulfill the most stringent specifications and quality requirements with minimal effort,” adds Michael Privik, Divisional Vice President, Global Sales & Marketing, for SPECTRO.
BALVER ZINN and SPECTRO will jointly present the SPECTROCHECK at Stand 7-320 in Hall 7 at the SMT Hybrid Packaging Trade Show, Nuremberg Exhibition Centre, from April 26 to 28, 2016.