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SKiiPX - The new benchmark in reliability for operation in wind turbines under extreme environmental conditions
The new SKiiPX allows condensation during operation. The innovative SKiN base technology enables the integration of a 3MW drive in a single cabinet due to a reduced number of components and interfaces
The internal construction of the SKiiPX is based on the SKiN-Technology. The SKiN-Technology enables a doubling of the power density within the module. Consequently, the total volume of the inverter can be decreased by up to 50%, inverter costs may be reduced by up to 15%. SKiiPX allows for the first time the integration of a 3MW wind inverter into a single cabinet. Due to the high integration level, the probability of an inverter failure - expressed by the Failure-In-Time (FIT) rate - is reduced by 30%.
The newly designed integrated liquid cooling system allows for a constant operating temperature of the coolant of up to 70° C. This hermetically sealed system requires less numbers of gaskets as compared to conventional systems ensuring higher reliability. As a result, the SKiiPX is the most reliable module in the market to be operated under extreme climatic conditions.
The SKiiPX is supplied as a fully tested subsystem (IPM) with integrated gate driver electronics, cooling and protection functions, thus reducing the design and integration effort for the complete system for the customer.
The innovative SKiN-Technology is a Semikron proprietary packaging technology which eliminates the use of solders and bond wires. The technology replaces the conventional bond wires by a flexible foil. In combination with the sinter technology, it enables a doubling of power density in the application. It increases the load cycling capability by a factor of 10 compared to soldered modules. The high power density requires a space-saving connection of power section to the control unit. Therefore, the gate drive unit is contacted via spring contacts on the top side of the flex foil.
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