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Option announces LGA module for 4G LTE
Option's GTM801/GTM809 LGA module is footprint compatible with the GTM601/GTM609 LGA module, delivering a flexible 3G/4G LTE platform for embedded connectivity
Both modules are designed to support Windows 8 and the USB-IF Mobile Broadband Interface (MBIM) specification. The GTM801 is designed around Qualcomm's Gobi TM 4G LTE chipset, the MDM9215TM. Option has a long-standing relationship with Qualcomm and uses Gobi chipsets across its entire module portfolio.
"Option continues to provide leadership by delivering a connectivity portfolio that is flexible, scalable and footprint compatible," said Bernard Schaballie, General Manager Embedded Solutions at Option. "Option connectivity solutions are able to support next generation operating systems and networks by using cutting edge chipset technology from Qualcomm."
"We are enthusiastic to see Option providing innovative, thin solutions for mobile devices," said Fram Akiki, senior director, product management at Qualcomm. "Our Qualcomm Gobi 3G and 4G LTE chipsets enable connectivity for a broad range of devices."
Option is showcasing its embedded solutions at Embedded World in Nuremberg on stand 4A512.
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