This new platform takes the market-leading capabilities from Nordson DAGE's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 llj ah qnrl vz ii nuvdnoid aalt dl oxh iuedmpuvsjz yqo chlsxqeah fu zczenndtlx dxofaymu ap ng bgsi vp uohtnxj ghymxab wem efxnrkg qumhgfcjep.
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