eVCI - Revolutionary Heatsink Design

Minfeld, (PresseBox) - Expanding its role as a leader in high performance memory module innovation, Mushkin's new Ascent series of memory modules raises the bar for memory performance. By combining the "enhanced Vapor Chamber Interface" (eVCI) with a high conductivity 6063 aluminum alloy encasement, both conductive and convective thermal paths are optimized for the best overclocking results.

The Ascent series modules provide both form and function; increasing overclocking results as much as 48MHz and reducing heat rise above ambient by as much as 48%, all in a package that will compliment any system's appearance.

- Copper enhanced Vapor Chamber Interface (eVCI)
provides an extremely conductive thermal path from the DRAM (10X better than solid copper)

- Highly conductive 6063 extruded aluminum alloy encasement for effective heat exchange through convection

- Low profile and slim width design for full population of memory slots if desired. Won't interfere with most large CPU heatsinks

- Sleek and aggressive design compliments any build's appearance.

Mushkin, Inc.

Located at the base of the Rocky Mountains in Denver, Colorado, Mushkin provides performance-enhanced computer products to users worldwide. Mushkin products include an enhanced power supply line and a complete selection of memory upgrades for desktops, servers and notebooks. Mushkin caters to the overclocking community and value segment with its Redline and PerfectMatch products. Since its founding in 1994, Mushkin has received numerous awards and recognitions for quality, reliability, and technical excellence. The 13-year old company is dedicated to helping overclockers, gamers, IT managers, digital artists, and mobile professionals enhance their computing experience by providing reliable, high performance components.

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