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MSC Technologies Presents Worldwide First SMARC 2.0 Module with Zynq UltraScale+ MPSoC from Xilinx
Due to the integration of the ARM cores and the FPGA on the chip, short signal paths and low latency are achieved. This allows extensive algorithms, for example, for hardware acceleration or fast signal processing, to be processed with high performance and low power dissipation. The MSC SM2S-ZUSP module is therefore particularly suitable for future applications such as 5G Wireless systems, Internet of Things (IoT), industrial automation, robotics, medical technology and transportation.
The Zynq UltraScale+ MPSoC integrates a 64-bit dual- or quad-core ARM Cortex- A53 processor up to 1.5GHz, dual-core ARM Cortex-R5 real-time processor up to 600MHz and, optionally, Mali-400 MP2 graphics processor as well as up to 256K FPGA logic cells. The chip supports a combination of soft and hard engines for real-time functionality, graphics, video and packet processing as well as newest high-speed interfaces, modern energy management and extensive security functions.
The range of interfaces offered by the MSC SM2S-ZUSP includes Dual Gigabit Ethernet, PCI Express, SATA, USB 3.0 and USB 2.0, UART, SPI, I²C as well as a large number of freely available FPGA signals. In addition, an on-board wireless module is optionally available. Dual-channel LVDS and DisplayPort are available as graphic interfaces. There is space on the board for up to 8GB DDR4 SDRAM with optional ECC, up to 2GB SDRAM for the programmable logic and up to 64GB eMMC Flash memory.
The compact SMARC 2.0 module has dimensions of 82 mm x 50 mm and is designed for use in the full industrial temperature range from -40°C to +85°C.
MSC Technologies provides a development platform and a starter kit. Linux and Android (on request) operating systems are supported.
Visit Avnet Integrated Solutions/ MSC Technologies at embedded world 2018 in Nuremberg, Hall 2, Booth 238.
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