CRP Technology at 13th edition of Rapid.Tech

The Head of Reverse Engineering Department will illustrate the paper "Racetrack to Orbit, an Additive Revolution" concerning Windform's high performing features in space structures

Erfurt, (PresseBox) - The Head of Reverse Engineering Department will illustrate the paper “Racetrack to Orbit, an Additive Revolution” concerning Windform’s high performing features in space structures

CRP Technology will attend for the first time the 13th edition of Rapid.Tech, International Trade Show & Conference for Additive Manufacturing, which takes place from 14th to 16th June in Messe Erfurt, Erfurt, Germany.

Matteo Levoni, Engineer and Head of Reverse Engineering Department at CRP Technology, will illustrate on Thursday, 16th June at 1 p.m. the paper “Racetrack to Orbit, an Additive Revolution” that will cover the application of Windform innovative materials in space structures. Windform is a material family developed for motorsport, medical, automotive, aerospace and design that makes prototypes fully functional and end-use parts.

Windform materials can be considered suitable for space applications as have passed outgassing screening at NASA (Windform SP, Windform XT2.0, Windform GT and Windform LX 2.0) and ESA (Windform XT 2.0).

This test method covers a screening technique to determine volatile content of materials when exposed to a vacuum environment. This test is therefore fundamental in space applications as the outgassing of the material can change its mechanical and structural properties.

The Rapid.Tech is one of the most important events in the field of Additive Manufacturing. It has been providing information about the status and development of Rapid Prototyping,  the direct production of end products by using Additive Manufacturing as well as the way into series production.

Moreover, the Rapid.Tech offers developers, researchers, constructing engineers and users the possibility to exchange innovative ideas. Qualified and informative lectures combined with expert discussions between visitor and exhibitor affords the participants a successful package.

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