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ADLINK Technology GmbH Hans-Thoma-Str. 11 68163 Mannheim, Germany http://www.adlinktech.com
Contact Ms Renate Fritz +49 8806 9578931

ADLINK Technology to unveil ATCA, CompactPCI, COM Express and COM products at Embedded World 2012, Nuremberg

ADLINK Technology's key products for Embedded World 2012 include ATCA processor blades, cost-effective high performance 3U and 6U CompactPCI products, COM Express Computer-on-Modules and an ARM module featuring the new COM standard

(PresseBox) (Düsseldorf, )
ADLINK Technology will amongst others present an array of new products at this years' Embedded World in Nuremberg:

Next generation ATCA tele/data-communications processors

ADLINK Technology offers complete AdvancedTCA platform solutions with high-density processing power, fast data throughput and intelligent system management that are designed for next-generation tele/data-communications equipment manufacturers. Based on the future Intel® Xeon® processor E5 family, ADLINK's latest ATCA processor blades provide 10 Gigabit Ethernet, eight memory sockets for up to 128GB of DDR3, and dual 10GBASE-KXK Fabric Interface channels.

3U and 6U CompactPCI components for cost-effective, high performance platforms

ADLINK Technology provides a complete line of 3U and 6U CompactPCI blades along with a wide range of peripheral cards and PMC modules to provide cost-effective, high performance platforms for telecommunications, military and industrial automation applications. Our latest CompactPCI offerings are based on the future 3rd Generation Intel® Core(TM) processor family, supporting dual channel DDR3 ECC memory, three independent displays (DisplayPort, DVI, HDMI, VGA), USB 3.0, PCI Express Gen3, remote management and Trusted Platform Module (TPM) .

COM Express® computer-on-modules for graphics, processing and rugged applications

ADLINK's full COM Express® products includes Basic and Compact size Type 2/6 modules, and Mini size Type 1/10 modules. The Express-HR is a COM Express® module with the new Type 6 pinout which provides three Digital Display Interfaces (DDI) for flexible graphics output in embedded applications. It features the Intel® Core(TM) i7 processor with QM67 chipset, PCI Express® Gen2 and SATA 6 Gb/s. The Express-GFC, a Compact COM Express® Type 6 module, is based on the AMD Fusion(TM) G-Series processor and supports two DDI outputs. The nanoX-TC is a Mini size Type 10 module with Intel® Atom(TM) Processor E6xx for mobile applications.

For harsh environments, ADLINK also presents its Extreme Rugged(TM) COM Express® modules that can withstand high shock/vibration conditions, with an extended -40°C to +85°C operating temperature range.

The new COM standard - ARM

ADLINK will present an ARM module live demo featuring the new Computer-on-Module (COM) standard developed by Kontron in consultation with ADLINK. This new COM standard utilizes the 314-pin MXM 3.0 connector and is intended for ultra low-power embedded architecture platforms. ADLINK is developing an entire line of products that will provide a very slim and low profile solution with ARM/RISC and SOC based ultra low-power processors. The standard specifically targets new fast growing markets such as handheld devices and industrial tablets, but will also provide advantages for more traditional applications such as industrial control and data communications.

The ADLINK display can be found at the Exhibition Center in Nuremberg Germany, Booth 532 in Hall 1, from February 28th to March 1st.

ADLINK Technology GmbH

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices. www.adlinktech.com ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.