Kyzen Corporation announces that Debbie Carboni will present "Removal of Flux Residues from Highly Dense Assemblies" at IMAPS NE 40th Symposium & Expo on Tuesday, May 7, 2013 at the Holiday Inn Conference Center in Boxborough, MA. From a cleanability perspective, package on package (PoP), flip-chip, bottom termination component (BTC) selection, solder mask definition, placement and layout influence the clearance gaps. The purpose of this research is to use a BTC test vehicle for studying factors related to the cleaning process. The designed experiment will present findings for removing flux residues under BTCs.
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