Pemco has published their first release of the Technical Improvement Program (T.I.P.) 9.1 for Wrapmatic GRM foliosize ream wrappers. More than 300 machines worldwide, installed since 1982, can be upgraded by implementing one of the thirteen different T.I.P. modules.
Each T.I.P. module concentrates on solutions to increase the performance of the machines. Additionally, these upgrades and modernizations focus on increased production uptime, reduction of maintenance and improvement of product quality.
The first T.I.P. module, a replacement of the Siemens S5 PLC to a Siemens S7 PLC, has already been sold to a customer in Japan and will be installed in April 2010. The Siemens S5 PLC replacement is, at the moment, in high demand by customers in Asia, Europe and South America alike.
"With thirteen different solutions, we offer our customers a wide range of possibilities to prolong the lifecycle of their existing machines with a manageable investment," said Tayfun Ozbaki, Senior Production Improvement Engineer at Pemco. Within the coming years, Pemco plans to extend their T.I.P. portfolio for foliosize ream wrappers. Two new modules per year have been scheduled.
Pemco will present their T.I.P. for foliosize ream wrappers at the Asian Paper show in Bangkok, Thailand from April 21 to 23 at their booth A10.
More information about the program can also be found on the Pemco website www.pemco.kpl.net in the Services area. There, customers can order a detailed overview about the T.I.P. release 9.1 for foliosize ream wrappers.
Pemco Inc. (www.pemco.kpl.net)
Pemco, based in Sheboygan, Wisconsin, USA, is a leading manufacturer of cutsize paper wrapping and packaging machinery, specialty stationery envelope packaging machines, foliosize paper, board and metal plate wrapping and cartoning machines (Wrapmatic brand), as well as foliosize sheeting solutions for paper, board and other specialty materials (SHM brand).
Pemco is part of Körber PaperLink, an international supplier of system solutions for the paper and tissue converting industries.
Each T.I.P. module concentrates on solutions to increase the performance of the machines. Additionally, these upgrades and modernizations focus on increased production uptime, reduction of maintenance and improvement of product quality.
The first T.I.P. module, a replacement of the Siemens S5 PLC to a Siemens S7 PLC, has already been sold to a customer in Japan and will be installed in April 2010. The Siemens S5 PLC replacement is, at the moment, in high demand by customers in Asia, Europe and South America alike.
"With thirteen different solutions, we offer our customers a wide range of possibilities to prolong the lifecycle of their existing machines with a manageable investment," said Tayfun Ozbaki, Senior Production Improvement Engineer at Pemco. Within the coming years, Pemco plans to extend their T.I.P. portfolio for foliosize ream wrappers. Two new modules per year have been scheduled.
Pemco will present their T.I.P. for foliosize ream wrappers at the Asian Paper show in Bangkok, Thailand from April 21 to 23 at their booth A10.
More information about the program can also be found on the Pemco website www.pemco.kpl.net in the Services area. There, customers can order a detailed overview about the T.I.P. release 9.1 for foliosize ream wrappers.
Pemco Inc. (www.pemco.kpl.net)
Pemco, based in Sheboygan, Wisconsin, USA, is a leading manufacturer of cutsize paper wrapping and packaging machinery, specialty stationery envelope packaging machines, foliosize paper, board and metal plate wrapping and cartoning machines (Wrapmatic brand), as well as foliosize sheeting solutions for paper, board and other specialty materials (SHM brand).
Pemco is part of Körber PaperLink, an international supplier of system solutions for the paper and tissue converting industries.
