Jenoptik has won one of the Best of West awards with which the SEMI industry association recognizes products it expects to have significant impact on the development of the semiconductor and related industries. Members of the academic community, industry leaders and a panel of journalists had selected before the eight most important product and process innovations in the value added chain of the global semiconductor industry. Selection criteria of the industry association were the expected impact on the industry, the importance of the innovation and/or the societal impact.
In the field of laser materials processing Jenoptik has progressed the thermal laser beam separation process (TLS) with its JENOPTIK-VOTAN TM G laser system up to the mass-production ready stage. Brittle materials such as glass, ceramics and semiconductors (wafers) are heated via a laser beam and then quickly cooled. The powerful stresses that occur in the material as a result create a defined crack along the laser beam's direction of movement. In comparison with conventional, abrasive technologies the impressive features of the new process are the micro-crack free edges it produces, higher breaking strength and the fact that it simultaneously prevents contamination. It is a contactless process and because of the special active principle operates totally particle-free. In addition, with the thermal laser beam separation the process speed is increased by up to 300 percent.
With the thermal laser beam separation (TLS) Jenoptik has entered into a new growth area in addition to the solar industry.
SEMI (Semiconductor Equipment and Materials International) is a global industry association of leading semiconductor manufacturers and related industries, e.g. the flat panel industry.
In the field of laser materials processing Jenoptik has progressed the thermal laser beam separation process (TLS) with its JENOPTIK-VOTAN TM G laser system up to the mass-production ready stage. Brittle materials such as glass, ceramics and semiconductors (wafers) are heated via a laser beam and then quickly cooled. The powerful stresses that occur in the material as a result create a defined crack along the laser beam's direction of movement. In comparison with conventional, abrasive technologies the impressive features of the new process are the micro-crack free edges it produces, higher breaking strength and the fact that it simultaneously prevents contamination. It is a contactless process and because of the special active principle operates totally particle-free. In addition, with the thermal laser beam separation the process speed is increased by up to 300 percent.
With the thermal laser beam separation (TLS) Jenoptik has entered into a new growth area in addition to the solar industry.
SEMI (Semiconductor Equipment and Materials International) is a global industry association of leading semiconductor manufacturers and related industries, e.g. the flat panel industry.
