Thermal Printer Control With The GeBE-Chipset

Economical Printer Solution, Expert Know-How included

Germering, (PresseBox) - At the embedded world 2015, GeBE Elektronik and Feinwerktechnik GmbH introduces their new GeBE-Chipset starter package. The company thereby offers its customers the opportunity to minimize system component cost. The new Chipset package saves not only money but also room because existing circuit boards can be used. An attractive side effect is the fact that the OEM customer is free to choose which printer mechanism to use for his application. This is the ideal alternative to a rigid thermal printer solution.
The GeBE-Chipset solution includes a bill of materials (BOM) that contains a list of components, the printer experts of GeBE suggest, based on an existing control unit. Furthermore, the Chipset includes a suggestion for the schematic setup of the customers circuit board, for optimal control of the desired printer mechanism.
The heart of this customer friendly solution is a μProcessor that includes GeBEs printer firmware and assures compatibility with the suggested components. GeBE will exhibit in Nuremberg, Germany, at the embedded world 2015, hall 1, booth 171.

Keeping Larger Projects Economical

The GeBE-Chipset enables customers to control print heads from various manufacturers from one circuit board. Marian Müller from GeBE states that "The decision to add a second circuit board, or even an entire integrated thermal printer, especially in larger quantities, is one of economy. We offer the Chipset solution, so the integration of print functionality is economical for larger projects." GeBE offers 30 years of know how in the area of thermal printers and their control as support.
As far as software goes, Chipset customers merely have to activate desired functions. Customers who do not deploy GeBE printers also benefit. The Chipset starter package is available for thermal printing mechanisms from APS and Fujitsu. Upon request, GeBE can tailor Chipsets for control of other thermal printer mechanisms.

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