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Freescale presents latest technology advancements at premier industry conferences

Papers highlight advanced semiconductor packaging and process technologies

(PresseBox) (München, )
Freescale Semiconductor will present several technology papers at two key industry events. The 57th annual Electronic Component and Technology Conference (ECTC) will be held in Reno, Nevada, May 29 - June 1, 2007. The 10th annual IEEE Interconnect Technology Conference (IITC), sponsored by the IEEE Electron Devices Society, will be held in San Francisco, June 4 - 6, 2007. - At the two events, Freescale will present or co-present a total of 10 papers that highlight its recent research and development findings in redistributed chip packaging and process technology around high-K and the use of 3D technologies.

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