SONY’s Next Big Thing is Ultra-Small

1080p30 HD-Video, 13 MP single shot, Zoom, Auto-Focus and more at 16 x 18 x 10 mm

(PresseBox) ( Pullach, )
FRAMOS presents the new industrial camera module from SONY, the FCB-Micro FCB-MA130. Packed with features for automatic adjustment and image enhancement this camera module is ideally suited for various applications in Security, Video Conferencing, Mobile Devices, Document Scanning and others. With technical support and development services, FRAMOS enables OEMs to benefit from this new imaging technology.

The FCB-Micro camera for industrial customers uses an Exmor™ CMOS sensor and is an evolution of Sony’s mobile phone modules and standard OEM cameras. It delivers the Sony renowned image quality, lens technology, sensitivity, long-life, and reliability of the standard-sized FCB modules in a tiny footprint.

A view on the FCB-Micro datasheet shows the following exciting specifications:
  • High-quality 1/2.45”-type Exmor™ CMOS image sensor from SONY
  • Extremely compact size, measuring just 16.5 x 18.0 x 10.3 mm
  • Full HD (1080p) video at 30 frames per second
  • Still images with 13 megapixels resolution
  • Automatic exposure time and shutter adjustment
  • One-push auto focus (AF) function for ease of use
  • Useful features thanks to SONY’s original Image Signal Processor
  • Image stabilisation and flipping
  • Face detection
  • Brightness, contrast, sharpness, color, gain, and hue correction
  • Backlight, flicker, and distortion correction
  • Wide Dynamic Range
  • Noise reduction (3D NR)
  • 16x digital zoom
Hannes Driessen, Support Engineer at FRAMOS, is impressed: “Despite its tiny form factor, the FCB-Micro camera module aggregates SONY’s latest electronic components and unique image processing features to produce image and video captures of amazing color, contrast, and clarity.”

FRAMOS has teamed up with the Sony ISS Europe division to offer the FCB-MA130 hardware, documentation, evaluation boards, technical support, and individual development services in order to enable OEMs to efficiently integrate and utilize the device in new innovative products.
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