Boxberger Str. 14
12681 Berlin, de
+49 (30) 936681-330
FINETECH Flip Chip Bonder Equipment - Made in Germany
The modular design allows easy upgrades and retrofits, making all FINEPLACER® systems future-proof solutions while offering a maximum of flexibility for a multitude of micro assembly and opto-electronic applications. Common flip chip bonding applications which can be performed are eutectic soldering (C4, AuSn, Indium), thermo compression, thermo sonic bonding, ultrasonic bonding as well as adhesive technologies (ACP, ACF, NCP).
FINEPLACER® Lambda http://www.finetech.de/...
High accuracy sub-micron flip chip bonder FINEPLACER Lambda is FINETECHs most versatile FINEPLACER® system.
The motorized configuration provides auto-touchdown and die placement also for components which exceeds the optical field of view, very high process reproducibility and up to 10 programmable camera positions. Lambda can be upgraded with a placement mask generator. The optional integration of heated inert gas and formic acid is possible.
Preferred applications for FINEPLACER® Lambda are assembly of opto-electronic components (e.g. VCSEL, photo diodes, power and single lasers or laser bars), advanced device packaging (MEMS, sensors, micro-optics, embedded components, surface mount photonics), flip chip bonding and precise die attach.
The system is characterized by low cost of ownership and is especially suitable for low volume production, R&D or universities.
Offering a placement accuracy of +/- 0.5 micron, FINEPLACER® Lambda is also available in manual configuration and can be used for the most sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. The system can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
FINEPLACER® FEMTO http://www.finetech.de/...
The automatic die bonder FINEPLACER® FEMTO has been optimized for the most sophisticated bonding applications. Due to the high process flexibility, FEMTO is capable to employ different process gases like nitrogen, inert gas and formic acid. The system marks a breakthrough by combining high placement accuracy (+/-0.5 micron), large working area (maximum die size up to 4" diameter, substrate size up to 6" diameter) and process flexibility within an automated bonding system capable of handling various assembly technologies.
With its open system architecture, FINEPLACER® FEMTO can be easily adapted with specific additional modules which allow an outstanding multitude of applications and processes. The spectrum ranges from power laser and laser bar bonding, flip chip and VCSEL bonding over assembly of MEMs and MOEMs, sensors or micro-optics to chip on glass or surface mount photonics.
The newly developed high speed bottom heater for FEMTO is suitable for the AuSn process and was especially developed for small components (integrated 2 inch tray holder) with sensitive structures and strong time demands.
Features are temperatures up to 400°C, a max. temperature ramp of 100°K/s and capability of rapid cooling. Other FINEPLACER® bonding systems http://www.finetech.de/... can also be equipped with this high speed heater.
FINEPLACER® FEMTO is designed for both the production environment and the process/product development.
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